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Move subsite#

A test that can be used to step to a specific subsite of the current die.

Description#

Steps the chuck to the specified subsite of the current die. The subsite is identified by its label as defined in the SENTIO wafer map (e.g. PCM_elt) or by its index. If the subsite does not exist or is not routable, an error occurs.

Input parameters#

The test requires to select a probe station, added in the device manager.

Parameter Description
Subsite Label or index of the subsite to step to. The value can be entered manually or selected using an existing Measmatic variable from a previous test.

Output parameters#

The test does not provide output parameters.

Supported devices#

The following devices are supported by this test:

  • MPI SENTIO Software Suite

Example#

Hardware setup:

Connect a supported Waferprober to the computer running Measmatic over TCP/IP, GPIB or RS232.

flowchart LR
    A(Measmatic) o---o |TCP/IP, 
    GPIB or 
    RS232| B(Waferprober)

In the device manager add the Waferprober to the current test site configuration. Change the name, the IP address in the device properties of the device. If needed, increase the communication timeout for the probe station device.

Measmatic setup:

  1. Add a Chuck separation test to the test sequence to lift the chuck before moving.
  2. Add a Move subsite test and enter the label of the subsite (e.g. PCM_elt).
  3. Add a Chuck contact test to move the chuck to contact at the new subsite.
  4. Execute the test sequence by pressing the Run all tests button.

See also:

Subsite stepping Chuck contact